The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) solutions. Highly integrated systems with greater miniaturisation and increased functionality open new markets and improve the quality of life through a wide range of applications. In particular, higher systems integration technologies using multi-chip packaging, through-silicon via technologies or package-stacking approaches are growing in importance. Market studies show that SiP devices will have an average growth of 10 to 20% per year over the next five years.